Join leading researchers and practitioners in the field of system simulation at the University of Niš, Faculty of Electronic Engineering
February 12-14, 2026 | University of Niš, Faculty of Electronic Engineering
https://doi.org/10.46793/SSSS2026.148N
Faculty of Electronic Engineering, Niš, Serbia
The paper is available at the following link: PDF
Long-term reliability of radio-frequency integrated circuits remains a practical concern that is sometimes over- looked during initial design phases, especially in cost-sensitive applications where design margins tend to be minimal. This paper reviews the main mechanisms behind performance degradation in RF circuits (Bias Temperature Instability, Hot Carrier Injection, electromigration, and Time-Dependent Di- electric Breakdown) with focus on how these phenomena affect gain, noise figure, and linearity over time. To illustrate these effects, we conducted a simulation study using QUCS-S with a simple common-source amplifier, varying the threshold voltage to mimic aging-induced parameter shifts. Within the scope of this work, this approach provides insight into expected performance trends, though it does not capture all aspects of real aging. We also discuss practical mitigation strategies that can help extend circuit lifetime.
RF circuits, aging, reliability, CMOS, BTI, HCI, electromigration, TDDB, simulation.
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