Faculty of Electronic Engineering, Niš, Serbia

Bauman Moscow State Technical University, Moscow, Russia

The paper is available at the following link: PDF

Abstract:

The scaling of CMOS technology to nanometer nodes has pushed Power Distribution Network (PDN) design into a critical regime where supply voltages drop below 1.0 V and dynamic currents exceed hundreds of amperes. To maintain voltage stability, the target impedance (Ztarget) has plummeted to sub-milliohm levels, rendering traditional bulk capacitance strategies obsolete. This paper critically examines the phenomenon of PCB package resonance, a dominant limiting factor in modern high-speed systems. We evaluate advanced mitigation techniques, including inductance decomposition, genetic algorithm (GA) optimization, and the pole-zero (P&Z) matching method. Furthermore, we analyze the efficacy of emerging Reversed Aspect Ratio (LW) capacitors and demonstrate that a "package-aware" co-design methodology is mandatory to avoid gross overdesign. The findings confirm that optimizing for controlled damping, rather than minimum impedance, is the only viable path to robust power integrity.

Keywords:

Power Integrity (PI), Power Distribution Network (PDN), Decoupling Capacitors, Target Impedance.

REFERENCES:

[1] I. Zamek, "Power Integrity Principles for nm-CMOS devices," in Proc. DesignCon 2021, Jan. 2021.
[2] I. Zamek, "New Power Integrity Methodology and mitigation effect of PDN voltage decay," in Proc. DesignCon 2022, Apr. 2022.
[3] F. de Paulis et al., "Suppression of Power Distribution Network PCB-Package Resonance for Low Target Impedance," in Proc. EMC Compo 2024, Oct. 2024.
[4] B. Zhao et al., "Systematic Power Integrity Analysis Based on Inductance Decomposition," IEEE EMC Magazine, vol. 9, no. 4, 2020. F. de Paulis et al., "Genetic Algorithm PDN Optimization," in Proc. IEEE EMCSI, Jul. 2020. Y. Ding et al., "System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors," in Proc. IEEE EMC+SIPI, 2023.
[5] F. de Paulis et al., "Package and IC Aware PCB PDN Design," in Proc. DesignCon 2023, Jan. 2023.